0C97055502

Laird Technologies EMI

Product No:

0C97055502

Package:

-

Batch:

-

Datasheet:

Description:

RFI EMI GROUNDING MATERIAL 25FT

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
Mfr Laird Technologies EMI
Type Fingerstock
Shape -
Width 0.340" (8.64mm)
Height 0.070" (1.78mm)
Length 24.000" (609.60mm)
Series Twist
Package Bulk
Plating Unplated
Material Beryllium Copper
Shelf Life -
Product Status Active
Shelf Life Start -
Attachment Method Adhesive
Plating - Thickness -
Operating Temperature 121°C
Storage/Refrigeration Temperature -