24-6574-18

Aries Electronics

Product No:

24-6574-18

Manufacturer:

Aries Electronics

Package:

-

Batch:

-

Datasheet:

Description:

CONN IC DIP SOCKET ZIF 24POS TIN

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
Mfr Aries Electronics
Type DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Series 57
Package Bulk
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Mounting Type Through Hole
Pitch - Mating 0.100" (2.54mm)
Product Status Active
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Contact Resistance -
Base Product Number 24-6574
Contact Finish - Post Tin
Current Rating (Amps) 1 A
Operating Temperature -
Contact Finish - Mating Tin
Contact Material - Post Beryllium Copper
Termination Post Length 0.110" (2.78mm)
Contact Material - Mating Beryllium Copper
Material Flammability Rating UL94 V-0
Contact Finish Thickness - Post 200.0µin (5.08µm)
Contact Finish Thickness - Mating 200.0µin (5.08µm)
Number of Positions or Pins (Grid) 24 (2 x 12)