HF115AC-0.0055-AC-105

Bergquist

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THERM PAD 36.83X21.29MM W/ADH

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Parameter Info

Mfr	Bergquist
Type	Pad, Sheet
Color	Gray
Shape	Rectangular
Usage	SIP
Series	Hi-Flow® 115-AC
Outline	36.83mm x 21.29mm
Package	Bulk
Adhesive	Adhesive - One Side
Material	Phase Change Compound
Thickness	0.0055" (0.140mm)
Shelf Life	12 Months
Product Status	Active
Backing, Carrier	Fiberglass
Shelf Life Start	Date of Manufacture
Base Product Number	HF115AC
Thermal Resistivity	0.35°C/W
Thermal Conductivity	0.8W/m-K
Storage/Refrigeration Temperature	-

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