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HSB13-303014

CUI Devices

Product No:

HSB13-303014

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, BGA, 30.7 X 30.7 X 14

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.209" (30.70mm)
Length 1.209" (30.70mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.551" (14.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 12.36°C/W
Power Dissipation @ Temperature Rise 6.1W @ 75°C
Thermal Resistance @ Forced Air Flow 4.70°C/W @ 200 LFM