CUI Devices
Product No:
HSB13-303014
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, BGA, 30.7 X 30.7 X 14
Quantity:
Please send RFQ , we will respond immediately.
Mfr | CUI Devices |
Type | Top Mount |
Shape | Square, Pin Fins |
Width | 1.209" (30.70mm) |
Length | 1.209" (30.70mm) |
Series | HSB |
Package | Box |
Diameter | - |
Material | Aluminum Alloy |
Fin Height | 0.551" (14.00mm) |
Package Cooled | BGA |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | Adhesive |
Thermal Resistance @ Natural | 12.36°C/W |
Power Dissipation @ Temperature Rise | 6.1W @ 75°C |
Thermal Resistance @ Forced Air Flow | 4.70°C/W @ 200 LFM |