CUI Devices
Product No:
HSB14-353518
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, BGA, 35 X 35 X 18 MM
Quantity:
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Mfr | CUI Devices |
Type | Top Mount |
Shape | Square, Pin Fins |
Width | 1.378" (35.00mm) |
Length | 1.378" (35.00mm) |
Series | HSB |
Package | Box |
Diameter | - |
Material | Aluminum Alloy |
Fin Height | 0.709" (18.00mm) |
Package Cooled | BGA |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | Adhesive |
Thermal Resistance @ Natural | 8.97°C/W |
Power Dissipation @ Temperature Rise | 8.4W @ 75°C |
Thermal Resistance @ Forced Air Flow | 3.60°C/W @ 200 LFM |