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HSB24-252510

CUI Devices

Product No:

HSB24-252510

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, BGA,25 X 25 X 10 MM

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 0.984" (25.00mm)
Length 0.984" (25.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.394" (10.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 18.10°C/W
Power Dissipation @ Temperature Rise 4.14W @ 75°C
Thermal Resistance @ Forced Air Flow 6.50°C/W @ 200 LFM