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HSE-B18254-0396H

CUI Devices

Product No:

HSE-B18254-0396H

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, EXTRUSION,TO-218, 25.

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular, Angled Fins
Width 1.654" (42.00mm)
Length 1.000" (25.40mm)
Series HSE
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.984" (25.00mm)
Package Cooled TO-218
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Base Product Number HSE-B18254
Thermal Resistance @ Natural 9.15°C/W
Power Dissipation @ Temperature Rise 8.2W @ 75°C
Thermal Resistance @ Forced Air Flow 2.29°C/W @ 200 LFM