HSE-B500-04H
CUI Devices
Product No:
HSE-B500-04H
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, EXTRUSION, TO-220, 50
Quantity:
In Stock : Please Inquiry
Please send RFQ , we will respond immediately.
Product Information
Parameter Info
| Mfr | CUI Devices |
| Type | Board Level, Vertical |
| Shape | Rectangular, Fins |
| Width | 1.378" (35.00mm) |
| Length | 1.969" (50.00mm) |
| Series | HSE |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 1.000" (25.40mm) |
| Package Cooled | TO-220 |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Bolt On and PC Pin |
| Base Product Number | HSE-B500 |
| Thermal Resistance @ Natural | 8.05°C/W |
| Power Dissipation @ Temperature Rise | 12.2W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 2.88°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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