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HSE01-193175P

CUI Devices

Product No:

HSE01-193175P

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, EXTRUSION, 19 X 31.5

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
Mfr CUI Devices
Type Top Mount
Shape Square, Angled Fins
Width 0.748" (19.00mm)
Length 0.748" (19.00mm)
Series HSE
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.295" (7.50mm)
Package Cooled -
Product Status Active
Material Finish Blue Anodized
Attachment Method Thermal Tape, Adhesive (Included)
Thermal Resistance @ Natural 25.44°C/W
Power Dissipation @ Temperature Rise 2.95W @ 75°C
Thermal Resistance @ Forced Air Flow 9.20°C/W @ 200 LFM