CUI Devices
Product No:
HSE05-171933
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, EXTRUSION, TO-218/TO-
Quantity:
Please send RFQ , we will respond immediately.
Mfr | CUI Devices |
Type | Board Level |
Shape | Rectangular, Angled Fins |
Width | 0.669" (17.00mm) |
Length | 0.764" (19.40mm) |
Series | HSE |
Package | Box |
Diameter | - |
Material | Aluminum Alloy |
Fin Height | 1.280" (32.50mm) |
Package Cooled | TO-218, TO-220 |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | PC Pin |
Thermal Resistance @ Natural | 18.83°C/W |
Power Dissipation @ Temperature Rise | 3.98W @ 75°C |
Thermal Resistance @ Forced Air Flow | 6.90°C/W @ 200 LFM |