CUI Devices
Product No:
HSE07-753045
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, EXTRUSION, TO-218/TO-
Quantity:
Please send RFQ , we will respond immediately.
Mfr | CUI Devices |
Type | Board Level |
Shape | Rectangular, Fins |
Width | 1.181" (30.00mm) |
Length | 2.953" (75.00mm) |
Series | HSE |
Package | Bag |
Diameter | - |
Material | Aluminum Alloy |
Fin Height | 1.772" (45.00mm) |
Package Cooled | TO-218, TO-220 |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | Clip |
Thermal Resistance @ Natural | 4.85°C/W |
Power Dissipation @ Temperature Rise | 15.46W @ 75°C |
Thermal Resistance @ Forced Air Flow | 2.10°C/W @ 200 LFM |