CUI Devices
Product No:
HSE09-755028
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, EXTRUSION, TO-218/TO-
Quantity:
Please send RFQ , we will respond immediately.
Mfr | CUI Devices |
Type | Board Level |
Shape | Rectangular, Angled Fins |
Width | 1.102" (28.00mm) |
Length | 2.953" (75.00mm) |
Series | HSE |
Package | Bag |
Diameter | - |
Material | Aluminum Alloy |
Fin Height | 1.969" (50.00mm) |
Package Cooled | TO-218, TO-220 |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | Clip |
Thermal Resistance @ Natural | 5.66°C/W |
Power Dissipation @ Temperature Rise | 13.26W @ 75°C |
Thermal Resistance @ Forced Air Flow | 2.50°C/W @ 200 LFM |