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HSE12-B20-NP

CUI Devices

Product No:

HSE12-B20-NP

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, EXTRUSION, TO-218/TO-

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
Mfr CUI Devices
Type Top Mount
Shape Rectangular
Width 0.472" (12.00mm)
Length 0.984" (25.00mm)
Series HSE
Package Bag
Diameter -
Material Aluminum Alloy
Fin Height 0.177" (4.50mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On
Thermal Resistance @ Natural 38.75°C/W
Power Dissipation @ Temperature Rise 1.94W @ 75°C
Thermal Resistance @ Forced Air Flow 19.20°C/W @ 200 LFM