CUI Devices
Product No:
HSS12-B20-P95
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, STAMPING, TO-220, 19
Quantity:
Please send RFQ , we will respond immediately.
Mfr | CUI Devices |
Type | Board Level, Vertical |
Shape | Rectangular |
Width | 0.748" (19.00mm) |
Length | 0.866" (22.00mm) |
Series | HSS |
Package | Box |
Diameter | - |
Material | Aluminum Alloy |
Fin Height | 0.433" (11.00mm) |
Package Cooled | TO-220 |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | PC Pin |
Thermal Resistance @ Natural | 27.37°C/W |
Power Dissipation @ Temperature Rise | 2.7W @ 75°C |
Thermal Resistance @ Forced Air Flow | 10.90°C/W @ 200 LFM |