CUI Devices
Product No:
HSS14-B20-NP
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, STAMPING, TO-220, 19.
Quantity:
Please send RFQ , we will respond immediately.
Mfr | CUI Devices |
Type | Board Level, Vertical |
Shape | Rectangular |
Width | 0.750" (19.05mm) |
Length | 0.980" (24.89mm) |
Series | HSS |
Package | Box |
Diameter | - |
Material | Aluminum Alloy |
Fin Height | 0.157" (4.00mm) |
Package Cooled | TO-220 |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | - |
Thermal Resistance @ Natural | 23.91°C/W |
Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
Thermal Resistance @ Forced Air Flow | 11.60°C/W @ 200 LFM |