HSS23-B20-NP
CUI Devices
Product No:
HSS23-B20-NP
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, STAMPING, TO-218/TO-2
Quantity:
In Stock : Please Inquiry
Please send RFQ , we will respond immediately.
Product Information
Parameter Info
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Rectangular, Fins |
| Width | 1.496" (38.00mm) |
| Length | 1.654" (42.00mm) |
| Series | HSS |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.787" (20.00mm) |
| Package Cooled | TO-218, TO-220 |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Bolt On |
| Thermal Resistance @ Natural | 10.19°C/W |
| Power Dissipation @ Temperature Rise | 7.36W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 5.00°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Information
Follow Us
Quick Links
