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HSS25-B20-P51

CUI Devices

Product No:

HSS25-B20-P51

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, STAMPING, TO-218/TO-2

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
Mfr CUI Devices
Type Board Level
Shape Square, Fins
Width 1.000" (25.40mm)
Length 1.000" (25.40mm)
Series HSS
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 1.673" (42.50mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method PC Pin
Thermal Resistance @ Natural 12.75°C/W
Power Dissipation @ Temperature Rise 5.88W @ 75°C
Thermal Resistance @ Forced Air Flow 6.30°C/W @ 200 LFM