Chip Quik Inc.
Product No:
PA0170-S
Manufacturer:
Package:
-
Batch:
-
Description:
MINI SOIC-8 EXP PAD STENCIL
Quantity:
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Mfr | Chip Quik Inc. |
Type | Mini SOIC |
Pitch | 0.026" (0.65mm) |
Series | Proto-Advantage PA |
Package | Bulk |
Material | Stainless Steel |
Thickness | 0.0040" (0.102mm) |
Product Status | Active |
Inner Dimension | 0.118" L x 0.118" W (3.00mm x 3.00mm) |
Outer Dimension | 1.300" L x 0.900" W (33.02mm x 22.86mm) |
Thermal Center Pad | 0.315" L x 0.067" W (8.00mm x 1.70mm) |
Number of Positions | 8 |