Chip Quik Inc.
Product No:
TS391LT250
Manufacturer:
Package:
-
Batch:
-
Description:
THERMALLY STABLE SOLDER PASTE NO
Quantity:
Please send RFQ , we will respond immediately.
Mfr | Chip Quik Inc. |
Form | Jar, 8.8 oz (250g) |
Type | Solder Paste |
Series | - |
Package | Bulk |
Process | Lead Free |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | 4 |
Shelf Life | 12 Months |
Wire Gauge | - |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Melting Point | 281°F (138°C) |
Shipping Info | - |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Base Product Number | TS391L |
Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |