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TS391LT250

Chip Quik Inc.

Product No:

TS391LT250

Manufacturer:

Chip Quik Inc.

Package:

-

Batch:

-

Datasheet:

Description:

THERMALLY STABLE SOLDER PASTE NO

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
Mfr Chip Quik Inc.
Form Jar, 8.8 oz (250g)
Type Solder Paste
Series -
Package Bulk
Process Lead Free
Diameter -
Flux Type No-Clean
Mesh Type 4
Shelf Life 12 Months
Wire Gauge -
Composition Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Melting Point 281°F (138°C)
Shipping Info -
Product Status Active
Shelf Life Start Date of Manufacture
Base Product Number TS391L
Storage/Refrigeration Temperature 68°F ~ 77°F (20°C ~ 25°C)