TS391SNL250
Chip Quik Inc.
Product No:
TS391SNL250
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
THERMALLY STABLE SOLDER PASTE NO
Quantity:
In Stock : Please Inquiry
Please send RFQ , we will respond immediately.
Product Information
Parameter Info
| Mfr | Chip Quik Inc. |
| Form | Jar, 8.8 oz (250g) |
| Type | Solder Paste |
| Series | - |
| Package | Bulk |
| Process | Lead Free |
| Diameter | - |
| Flux Type | No-Clean |
| Mesh Type | 4 |
| Shelf Life | 12 Months |
| Wire Gauge | - |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Shipping Info | - |
| Product Status | Active |
| Shelf Life Start | Date of Manufacture |
| Base Product Number | TS391S |
| Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Information
Follow Us
Quick Links
