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TS991SNL500T3

Chip Quik Inc.

Product No:

TS991SNL500T3

Manufacturer:

Chip Quik Inc.

Package:

-

Batch:

-

Datasheet:

Description:

SOLDER PASTE THERMALLY STABLE NC

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
Mfr Chip Quik Inc.
Form Jar, 17.64 oz (500g)
Type Solder Paste
Series CHIPQUIK®
Package Bulk
Process Lead Free
Diameter -
Flux Type No-Clean
Mesh Type 3
Shelf Life 12 Months
Wire Gauge -
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point 423°F (217°C)
Product Status Active
Shelf Life Start Date of Manufacture
Base Product Number TS991S