Chip Quik Inc.
Product No:
TS991SNL500T3
Manufacturer:
Package:
-
Batch:
-
Description:
SOLDER PASTE THERMALLY STABLE NC
Quantity:
Please send RFQ , we will respond immediately.
Mfr | Chip Quik Inc. |
Form | Jar, 17.64 oz (500g) |
Type | Solder Paste |
Series | CHIPQUIK® |
Package | Bulk |
Process | Lead Free |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | 3 |
Shelf Life | 12 Months |
Wire Gauge | - |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Melting Point | 423°F (217°C) |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Base Product Number | TS991S |