TSX713
EDSYN INCORPORATED
Product No:
TSX713
Manufacturer:
Package:
-
Batch:
-
Datasheet:
-
Description:
REFLOW VACUUM TIP, HOLE DIA: 1.3
Quantity:
In Stock : Please Inquiry
Please send RFQ , we will respond immediately.
Product Information
Parameter Info
| Mfr | EDSYN INCORPORATED |
| Width | - |
| Height | - |
| Length | 0.551" (14.00mm) |
| Series | SOLDAVAC® |
| Package | Bag |
| Diameter | 0.051" (1.30mm) |
| Tip Type | Rework |
| Tip Shape | Nozzle |
| Tip Chip Size | - |
| Product Status | Active |
| Temperature Range | - |
| For Use With/Related Products | - |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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